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ChipGuard ? CG0805MLA Series - ESD Protector Array
Product Dimensions
Recommended Pad Layout
BL
P
X
W
X
A
D
E
S
L
B
CG0805
BW
T
C
Dimension
L
W
T
BW
BL
P
Series
1.25 ± 0.20
(0.049 ± 0.008)
2.00 ± 0.20
(0.080 ± 0.008)
0.90
(0.035) MAX.
0.20 ± 0.10
(0.008 ± 0.004)
0.20 ± 0.10
(0.008 ± 0.004)
0.50
(0.020)
DIMENSIONS:
MM
(INCHES)
Dimension
A
B
C
D
E
CG0805
Series
0.64
(0.025)
1.27
(0.050)
1.91
(0.075)
0.28
(0.011)
0.51
(0.020)
X
S
0.75 ± 0.10
(0.029 ± 0.004)
0.25 ± 0.10
(0.009 ± 0.004)
Solder Re?ow Recommendations
300
Preheat Stages 1-3
Soldering
Cooling
250
A
Stage 1 Preheat
Ambient to Preheating
Temperature
30 s to 60 s
200
150
100
50
0
110 sec. (min.)
30-70
120 sec. (min.)
B
C
D
E
Stage 2 Preheat
Stage 3 Preheat
Main Heating
Cooling
140 °C to 160 °C
Preheat to 200 °C
200 °C
210 °C
220 °C
230 °C
240 °C
200 °C to 100 °C
60 s to 120 s
20 s to 40 s
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
1 °C/s to 4 °C/s
sec.
Time (seconds)
?
?
?
?
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Speci?cations are subject to change without notice.
Customers should verify actual device performance in their speci?c applications
发布紧急采购，3分钟左右您将得到回复。
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